Method for forming conductive pattern, method for forming wiring, method for manufacturing semiconductor device, method for manufacturing circuit board, method for manufacturing electronic component, conductive pattern, wiring, semiconductor device, circuit board, electronic component, and electronic equipment



<P>PROBLEM TO BE SOLVED: To provide a method for inexpensively forming a conductive pattern with less facility investment. <P>SOLUTION: The surface of a core member 12 formed by a photo-fabrication technique is plated for its conduction. Using conductive resin (polymer material such as pyrrole exhibiting a metal conductivity or insulating resin such as acryl having conductive fine particles incorporated therein) as the material of the core member, an arbitrary shape of a three-dimensional pattern can be formed only by a core member forming step (photo-fabrication step). <P>COPYRIGHT: (C)2005,JPO&NCIPI
【課題】 設備投資が少なく安価にパターンを形成することのできる導電パターンの形成方法を提供する。 【解決手段】 光造形技術によって形成した芯材12の表面にメッキ処理を施して導電化する。また、芯材に導電性の樹脂(ピロール等の金属導電性を示す高分子材料、或いは、アクリル等の絶縁性の樹脂に導電性微粒子を練り込んだもの)を用いることで、芯材の形成工程(光造形工程)のみで任意の形状の3次元パターンを形成する。 【選択図】 図1




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Cited By (1)

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    US-8134081-B2March 13, 2012Panasonic CorporationThree-dimensional circuit board and its manufacturing method